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Adhesives-Sealants

Bondline™ 6050

Bondline 6050 will partially cure and develop structural strength within 3 minutes @ 95°C, or within 4 hours @ room temperature.

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Bondline™ 6460

Bondline 6460 is a premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.

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Bondline™ 6640

Bondline 6640 is a flowable epoxy adhesive designed for general microelectronics and medical applications. This epoxy exhibits excellent adhesion to clean metal surfaces.

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Bondline™ 7780

Bondline™ 7780 is a medium viscosity epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, or lid sealing adhesive.

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Bondline™ 6555

Bondline™ 6555 is a low viscosity adhesive that can be cured at room temperature. It provides excellent physical bonds for semi porous materials. Its light color and high clarity make 6555 excellent for bonding optics.

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Bondline™ 6560

Bondline™ 6560 is a very low viscosity epoxy adhesive that can be cured at room temperature. It provides excellent physical bonds for semi porous materials. Its light color and high clarity are ideal for bonding optics.

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Bondline™ 7784

Bondline™ 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver,and copper.

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Butanone

Butanone is an organic compound. It is an effective and common solvent and is used in processes involving gums, resins, cellulose acetate and nitrocellulose coatings and in vinyl films. For this reason it finds use in the manufacture of plastics, textiles, in the production of paraffin wax, and in household products such as lacquer, varnishes, paint remover, a denaturing agent for denatured alcohol, glues, and as a cleaning agent. It is also used in dry erase markers as the solvent of the erasable dye. As butanone melts polystyrene, it is sold as "polystyrene cement" for use in connecting together parts of scale model kits. Though often considered an adhesive, it is actually functioning as a welding agent in this context. It is the precursor to methyl ethyl ketone peroxide, a catalyst for some polymerization reactions.

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Butyl Methacrylate

Butyl Methacrylate is a base material for coatings and adhesives. It is used in resins, solvent, coatings, adhesives, oil additives, dental products, textile emulsions, leather and paper finishing.

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C5 Petroleum Resin

C5 Petroleum Resin is used for adhesive applications especially for hot-melt adhesive,pressure-sensitive adhesive and sealants.

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