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Hytech C is mildly acidic cobalt hardened gold process and is used for rack and barrel plating for industrial applications.
Hytech N is mildly acidic nickel hardened gold process and is used for rack and barrel plating for industrial applications.
Hytech P is neutral gold process formulated specifically for printed circuit boards.
AURUNA 311 has been specifically developed for direct gilding of stainless steel.
AURUNA 527 produces a nickel gold alloy deposit and has been designed specifically for barrel plating.
AURUNA 531 is a weakly acidic electrolyte for the deposition of bright, hard gold coatings-deep yellow in colour.
AURUNA 550 is a neutral electrolyte with high current efficiency producing matt yellow, pure gold deposits.
Goldspec C is mildly acidic high-speed cobalt hardened gold process.
Goldspec N is mildly acidic high-speed nickel hardened gold process.
Hytech 918 is neutral gold process with excellent throwing power. It eliminates arsenic or thallium as grain refiners.
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