Buy gold plating chemicals method depositing gold layer another metal surface

Gold-Plating-Chemicals

Hytech C

Hytech C is mildly acidic cobalt hardened gold process and is used for rack and barrel plating for industrial applications.

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Hytech N

Hytech N is mildly acidic nickel hardened gold process and is used for rack and barrel plating for industrial applications.

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Hytech P

Hytech P is neutral gold process formulated specifically for printed circuit boards.

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AURUNA 311

AURUNA 311 has been specifically developed for direct gilding of stainless steel.

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AURUNA 527

AURUNA 527 produces a nickel gold alloy deposit and has been designed specifically for barrel plating.

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AURUNA 531

AURUNA 531 is a weakly acidic electrolyte for the deposition of bright, hard gold coatings-deep yellow in colour.

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AURUNA 550

AURUNA 550 is a neutral electrolyte with high current efficiency producing matt yellow, pure gold deposits.

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Goldspec C

Goldspec C is mildly acidic high-speed cobalt hardened gold process.

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Goldspec N

Goldspec N is mildly acidic high-speed nickel hardened gold process.

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Hytech 918

Hytech 918 is neutral gold process with excellent throwing power. It eliminates arsenic or thallium as grain refiners.

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