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Bondline 6400

Bondline 6400 is a premixed, degassed and frozen epoxy adhesive.It provides good bond strength to materials such as glass, ferrite, aluminum and steel.

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Bondline 6407

Bondline 6407 is a filled epoxy adhesive with high dimensional stability. It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.

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Bondline 6460

Bondline 6460 is a premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.

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Bondline 6470

Bondline 6470 is a filled epoxy adhesive with high dimensional stability.It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.

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Bondline 6515

Bondline 6515 is a rapid cure, low outgassing, controlled flow version of the Bondline¬ô 6500 series adhesives.

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Bondline 6570

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. It used as a general purpose encapsulating and sealing adhesive.It has excellent impact and thermal shock resistant properties.

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Bondline 6577

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature.It is used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock properties.

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Bondline 6680

Bondline 6680 is a premixed, frozen, low viscosity adhesive developed for wet coil winding.

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Bondline 6770

Bondline 6770 is a dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.

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Bondline 6771

Bondline 6771 is a dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.

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