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Bondline 6860

Bondline 6860 is a polyurethane adhesive that is premixed,degassed and frozen. It bonds well to flexible medical tubing such as PVC and polyurethane surfaces.

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Bondline 6875

Bondline 6875 is a semiconductor grade polyurethane adhesive that is premixed, degassed and frozen. It bonds well to a wide variety of surfaces, such as aluminum, copper, rubber, nylon and steel.

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Bondline 6900

Bondline 6900 is a low viscosity epoxy adhesive that bonds well to glass, ferrite, gold and ceramic. It has low extractable ions, which make it suitable for semiconductor,tape head applications.

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Bondline 6905

Bondline 6905 is a combination flux and underfill epoxy encapsulant. after solder reflow and cool down the gelled underfill epoxy is post cured at 150-160°C for 90-120 minutes.

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Bondline 6959

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

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Bondline 6968

Bondline 6968 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening.

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Bondline 6980

Bondline 6980 is a semiconductor grade epoxy, with a low mobile ion concentration. It can be used as a Flip Chip underfill adhesive.

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Bondline 7080

Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

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Bondline 7081

Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

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Bondline 7794

Bondline 7794 is a viscous, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrates attach, heat sink attach, lid sealing and component staking adhesive.

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