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Appretto Mild

Appretto Mild gives a medium bright glossy with a silky touch. Appretto Mild closes the pores emphasizing the leather natural features. Appretto Mild doesn’t demand further operations.

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Ardex-Flex Fl

Ardex-Flex Fl grout is suitable for grouting joints between porcelain, ceramic,natural stone and quarry tiles, as well as extruded tiles and glass blockwork.

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Barium Borate

Barium Borate is an inorganic compound, a borate of barium. It is available as a hydrate or dehydrated. It is a biocide. Barium Borate is added to paints, coatings, adhesives, plastics, and paper and paper products. Barium borate is resistant to moisture and ultraviolet radiation. It can act as UV stabilizer for polyvinyl chloride.

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Bayhydur 3100

Bayhydur 3100 is a hydrophilic aliphatic polyisocyanate based on hexamethylene diisocyanate, which is used as the hardener component for high-quality aqueous two-pack polyurethane systems and as an additive to improve the property profile of aqueous coating and adhesive systems. Due to its hydrophilic character, Bayhydur 3100 can be easily emulsified in the aqueous phase. It is used mainly as the crosslinking agent for aqueous polyol binders (Bayhydrol). It can also be added to conventional OH-free dispersions to improve their property profiles.

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Bisomer C13MA

Bisomer C13MA is hydrophobic, mono functional methacrylate monomer with a low glass transition temperature (Tg) excellently suited as a flexibilising and plasticising monomer.

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Bondline 2072

Bondline 2072 is a rapid cure, low outgassing, electrically conductive epoxy adhesive.

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Bondline 2080

Bondline 2080 is a degassed, low viscosity, silver filled, premixed and frozen epoxy. It is formulated for general purpose applications.It provides good adhesion and low volume resistivity with room temperature or slightly elevated heat cure.

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Bondline 2120

Bondline 2120 is a low viscosity, silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with a room temperature or slightly elevated heat cure.

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Bondline 2121

Bondline 2121 is a degassed, low viscosity, silver filled, premixed and frozen epoxy. It is formulated for general purpose applications.It provides good adhesion and low volume resistivity with a room temperature or slightly elevated heat cure.

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Bondline 2160

Bondline 2160 is a high viscosity, silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with a room temperature or slightly elevated heat cure.

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