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Bondline 6175 is a premixed and frozen structural epoxy adhesive. It is formulated for high peel strength and micro-dimensional stability in magnetic head applications. Its moisture resistant characteristics prevent swelling when subjected to high humidity and thermal cycling.
Bondline 6400 is a premixed, degassed and frozen epoxy adhesive.It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Bondline 6407 is a filled epoxy adhesive with high dimensional stability. It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.
Bondline 6460 is a premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Bondline 6470 is a filled epoxy adhesive with high dimensional stability.It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.
Bondline 6515 is a rapid cure, low outgassing, controlled flow version of the Bondline 6500 series adhesives.
Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. It used as a general purpose encapsulating and sealing adhesive.It has excellent impact and thermal shock resistant properties.
Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature.It is used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock properties.
Bondline 6680 is a premixed, frozen, low viscosity adhesive developed for wet coil winding.
Bondline 6770 is a dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.
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