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Bondline 2160 is a high viscosity, silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with a room temperature or slightly elevated heat cure.
Bondline 2258 is an electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.
Bondline 2900 is a silver filled semiconductor grade die attach epoxy.It is non-tailing, non-bleeding,non-corrosive. Bondline 2900 is ideal for auto dispensing, stamping,screening, and excellent adhesion to copper, silver, and gold surfaces.
Bondline 2920 is a silver filled, electrically conductive epoxy adhesive. It has low levels of water extractible ionic contaminates. It is designed for microelectronic chip bonding.
Bondline 2948 is a silver filled, die attach adhesive. It has excellent adhesion to silver and gold surfaces.
Bondline 2990 is a silver filled, die attach adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.It has excellent adhesion to copper, silver and gold.
Bondline 6158 is a dielectric, flexible adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.
Bondline 6175 is a premixed and frozen structural epoxy adhesive. It is formulated for high peel strength and micro-dimensional stability in magnetic head applications. Its moisture resistant characteristics prevent swelling when subjected to high humidity and thermal cycling.
Bondline 6400 is a premixed, degassed and frozen epoxy adhesive.It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Bondline 6407 is a filled epoxy adhesive with high dimensional stability. It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.
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