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Bondline 2258 is an electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.
Bondline 2900 is a silver filled semiconductor grade die attach epoxy.It is non-tailing, non-bleeding,non-corrosive. Bondline 2900 is ideal for auto dispensing, stamping,screening, and excellent adhesion to copper, silver, and gold surfaces.
Bondline 2920 is a silver filled, electrically conductive epoxy adhesive. It has low levels of water extractible ionic contaminates. It is designed for microelectronic chip bonding.
Bondline 2948 is a silver filled, die attach adhesive. It has excellent adhesion to silver and gold surfaces.
Bondline 2990 is a silver filled, die attach adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.It has excellent adhesion to copper, silver and gold.
Bondline 6158 is a dielectric, flexible adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.
Bondline 6175 is a premixed and frozen structural epoxy adhesive. It is formulated for high peel strength and micro-dimensional stability in magnetic head applications. Its moisture resistant characteristics prevent swelling when subjected to high humidity and thermal cycling.
Bondline 6400 is a premixed, degassed and frozen epoxy adhesive.It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Bondline 6407 is a filled epoxy adhesive with high dimensional stability. It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.
Bondline 6460 is a premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
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