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Bondline 6470

Bondline 6470 is a filled epoxy adhesive with high dimensional stability.It offers good adhesion between ferrite and ceramic, even when exposed to humidity and thermal cycling.

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Bondline 6515

Bondline 6515 is a rapid cure, low outgassing, controlled flow version of the Bondline¬ô 6500 series adhesives.

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Bondline 6570

Bondline 6570 is a medium viscosity epoxy adhesive that can be cured at room temperature. It used as a general purpose encapsulating and sealing adhesive.It has excellent impact and thermal shock resistant properties.

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Bondline 6577

Bondline 6577 is a medium viscosity epoxy adhesive that can be cured at room temperature.It is used as a general purpose encapsulating and sealing adhesive, it has excellent impact and thermal shock properties.

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Bondline 6680

Bondline 6680 is a premixed, frozen, low viscosity adhesive developed for wet coil winding.

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Bondline 6770

Bondline 6770 is a dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.

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Bondline 6771

Bondline 6771 is a dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.

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Bondline 6860

Bondline 6860 is a polyurethane adhesive that is premixed,degassed and frozen. It bonds well to flexible medical tubing such as PVC and polyurethane surfaces.

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Bondline 6875

Bondline 6875 is a semiconductor grade polyurethane adhesive that is premixed, degassed and frozen. It bonds well to a wide variety of surfaces, such as aluminum, copper, rubber, nylon and steel.

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Bondline 6900

Bondline 6900 is a low viscosity epoxy adhesive that bonds well to glass, ferrite, gold and ceramic. It has low extractable ions, which make it suitable for semiconductor,tape head applications.

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