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Bondline 6905

Bondline 6905 is a combination flux and underfill epoxy encapsulant. after solder reflow and cool down the gelled underfill epoxy is post cured at 150-160°C for 90-120 minutes.

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Bondline 6959

Bondline 6959 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.

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Bondline 6968

Bondline 6968 is a dielectric semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive. It is ideal for auto dispensing, stamping, and screening.

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Bondline 6980

Bondline 6980 is a semiconductor grade epoxy, with a low mobile ion concentration. It can be used as a Flip Chip underfill adhesive.

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Bondline 7080

Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

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Bondline 7081

Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.

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Bondline 7794

Bondline 7794 is a viscous, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrates attach, heat sink attach, lid sealing and component staking adhesive.

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Butyl Acetate

n-Butyl acetate, also known as butyl ethanoate, is an organic compound commonly used as a solvent in the production of lacquers and other products.It is also used as a synthetic fruit flavoring in foods such as candy, ice cream, cheeses, and baked goods.It is found in many types of fruit, where along with other chemicals it imparts characteristic flavors. Apples, especially of the Red Delicious variety, are flavored in part by this chemical.

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Carbo e-Therm

Carbo e-Therm is a high-efficiency, electrically heated coating developed for use in the nonhazardous low-voltage range.Carbo e-Therm is suitable for temperatures up to approx. 500°C. Its excellent applicability to very different geometries and surfaces plus high heating power open up a wide field of possible uses.

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DURAL 452 GEL

DURAL 452 GEL is a two-component, 100% solids, DOT non-corrosive, moisture insensitive, high strength epoxy adhesive and binder for numerous applications. This high modulus, structural gel is perfect for bonding applications that require a non-sag adhesive. The features are it provides exceptional adhesion to construction materials and provides superior strength. Its application include bonding of concrete, masonry, steel, or wood and further it can mix with sand to create a repair mortar.

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