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ARDEX X 7G Plus is a high yield, grey, cement-based floor and wall tile adhesive, specifically formulated to have a high yield per bag along with enhanced properties of adhesion and flexibility ideal for fixing fully vitrified or porcelain tiles (internal areas only)and other tiles with low porosity as well as glass and porcelain mosaics without the need of an admixture.ARDEX X 7 G Plus can be applied to dry or moist surfaces but moisture sensitive materials must be dry and remain dry after fixing.ARDEX X 7 G Plus contains a reducing agent to control the level of Chromium VI when mixed prior to use.

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Antioxidant SN-1

Antioxidant SN-1 is a highly active, non-discoloring secondary antioxidant with low volatility. It can be used with primary phenolic and amine antioxidants. Unlike other thioesters, this product may be used in both uncured and sulfur cured latex compounds, and the maximum benefits are best noticed when used in combination with a primary antioxidant.

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Araldite GY 6010

Araldite GY 6010 is a general purpose, unmodified, medium viscosity epoxy resin based on Bisphenol A. This product is characterized by its reactivity, compatibility, and low hydrolysable chlorine content. It is used in the formulation of chemical resistant coatings and matrix adhesives.

Benzoyl Peroxide

Benzoyl peroxide is an organic compound in the organic peroxide family. It consists of two benzoyl groups joined by a peroxide group. It is one of the most important organic peroxides in terms of applications and the scale of its production. Benzoyl peroxide is used as an acne treatment, for improving flour, for bleaching hair and teeth, for polymerising polyester and many other uses.Its is also used as a radical initiator to induce polymerizations,antiseptic and bleaching,Carpatch Hardener for hot melt and liquid adhesives.

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Bisomer PPM 5 LI

Bisomer PPM 5 LI is a firmly established capping agent in urethane methacrylate oligomers for the production of photopolymer printing plates and dry film resists.

Bondline 2900 LV

Bondline 2900 LV is a silver filled semiconductor grade die attach epoxy. It is non-tailing, non-bleeding, non-corrosive. Bondline 2900 LV is ideal for auto dispensing, stamping, screening, and excellent adhesion to copper, silver, and gold surfaces.

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Bondline™ 6555

Bondline™ 6555 is a low viscosity adhesive that can be cured at room temperature. It provides excellent physical bonds for semi porous materials. Its light color and high clarity make 6555 excellent for bonding optics.

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Bondline™ 6560

Bondline™ 6560 is a very low viscosity epoxy adhesive that can be cured at room temperature. It provides excellent physical bonds for semi porous materials. Its light color and high clarity are ideal for bonding optics.

Bondline™ 7784

Bondline™ 7784 is a medium viscosity, one component, thermally conductive epoxy adhesive. It has excellent impact, thermal and moisture resistance. It is used as an encapsulating, substrate attach, heat sink attach, lid sealing and component staking adhesive. It exhibits strong adhesion to difficult-to-bond metals, such as gold, silver,and copper.

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