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Calcium boride is a compound of calcium and boron. It is an important material due to its high electrical conductivity, hardness, chemical stability, and melting point. It is used in the manufacturing of boron-alloyed steel and as a deoxidation agent in production of oxygen-free copper. It can also serve as a high temperature material, surface protection, abrasives, tools, and wear resistant material. It is highly conductive, has low work function, and thus can be used as a cathode material. It is also a promising candidate for n-type thermoelectric materials, because its power factor is larger than or comparable to that of common thermoelectric materials Bi2Te3 and PbTe.
Phthalocyanine is an intensely blue-green coloured macrocyclic compound that is widely used in dyeing.They are also used as dyes or pigments.It is also commonly used as a dye in the manufacture of high-speed CD-R media.They are also used in paper industry.
Tetraethyl tin is a chemical compound. It is used in the electronics industry.
Triethylindium is an olorganic chemical compound from the group of organometallic compounds. Its chemical formula is C6H15In.It can be obtained by reacting an ether solution of indium(III) chloride with ethyl magnesium chloride.Triethylindium is a colorless, toxic, oxidation and hydrolysis-sensitive liquid. It is a monomer in the gaseous and dissolved state. The compound reacts with halomethanes to diethyl indium halides.Triethylindium is used to prepare indium phosphide layers for semiconductors.
Trimethylboron is a stable boron source.It is a key material for the production of thin film solar cells,boron source for the simultaneous deposition of boron and carbon or as the boron source in BPSG deposition.
ABRON BR 720 FR can be used to prepare laminates for the electronics industry by the standard techniques used in the field. The resin, ABRON BR 720 FR, is dissolved in an solvent and then used to impregnate fabric (glass, silica, etc) and then dried at an elevated temperature to form a prepreg. The prepregs so obtained may be laminated with copper foil under pressure and temperature. These laminates can be used in fabrication of printed circuit boards having improved properties (Low dielectric constant, improved toughness and excellent thermal resistance).
Actalys-Optalys as excellent thermal stability,developed and stable surface area.It also has high and accessible oxygen storage capacity.
Bondline 6050 will partially cure and develop structural strength within 3 minutes @ 95°C, or within 4 hours @ room temperature.
Bondline 6460 is a premixed, degassed and frozen epoxy adhesive. It provides good bond strength to materials such as glass, ferrite, aluminum and steel.
Gallium Nitride is a very hard, mechanically stable wide band gap semiconductor material with high heat capacity and thermal conductivity. Gallium Nitride is the most important semiconductor material since silicon. It can be used to emit brilliant light in the form of light emitting diodes (LEDs) and laser diodes, as well as being the key material for next generation high frequency, high power transistors capable of operating at high temperatures.
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