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Gictane 70

Gictane 70 is a powdered, acidic, fluoride useful in acid pickle of metals. It is much less hazardous to handle than liquid Hydrofluoric acid.

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Gictane 73

Gictane 73 is easy to handle powdered product used in place of mineral acid solution for activating metal surfaces prior to plating. It is also used for removal of silicate and oxide films from most metals and facilitates excellent adhesion of subsequent electrodeposits.

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Gictane AAA

Gictane AAA is used in sulphuric, phosphoric, hydrofluoric and hydrochloric acid pickles to reduce fuming. Gictane AAA increases surface wetting to promote better pickling and also prevents re-deposition of oil.

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Gictane Inhibitor 11

Gictane Inhibitor 11 is an economical process, which in conjunction with sulphuric or hydrochloric acid inhibits on most steels including some hi-carbon steels.

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Gictane Inhibitor 12

Gictane Inhibitor 12 is the most efficient Hydrochloric acid corrosion inhibitor. It is specially designed to protect the steel during de-rusting operations.

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Ginplate AD - 481

Ginplate AD - 481 is a powdered material that is dissolved in water to make mild etch solution for copper. Ginplate AD - 481 operating solutions may be used in place of Ammonium persulphate etch in the manufacture of printed circuit boards with plated thru-holes.The primary function of the Ginplate AD - 481 operating solution is to provide a clean, uniformly-etched copper surface on printed circuit boards prior to surface activation and electroless plating of thru-holes.

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Ginplate Activator - 444

Ginplate Activator - 444 is palladium based catalyst in electroless copper plating system for printed circuit boards thru-hole plating. Ginplate Activator - 444 has small particle size of palladium / tin colloid that gives better ability to cover hole surface topography and better adhesion of electroless copper. It has high copper tolerance (up to 5000 ppm) and long bath life.

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Ginplate CC 50

Ginplate CC 50 is a mild alkaline liquid cleaner. It is effective for soak cleaning of PCB to remove tarnish, soils and finger marks. Unique conditioner for 100 % activation of hole wall. Ginplate CC 50 promotes a uniform, fine grained adherent deposit.

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Ginplate CU - 406

Ginplate CU-406 is highly stable, room temperature, electroless copper plating bath designed for flash-type printed circuit board processing. Ginplate Cu-406 deposits are bright pink in colour and facilitate easy inspection of thru-holes after plating. Ginplate CU-406 is a moderate speed bath that chemically deposits a bright, dense, uniform conductive coating on the walls of thru-holes.

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Ginplate Cu - 703

Ginplate Cu-703 is an electroless copper plating process for printed circuit boards. It can be used as a high speed bath, plating 2.0 to 3.0 microns in 30 minutes.Ginplate Cu-703 is exceptionally stable and properly maintained solutions may be operated over long periods without decomposition.

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