Buy gold plating chemicals method depositing gold layer another metal surface

chemical-categories

Hytech 918

Hytech 918 is neutral gold process with excellent throwing power. It eliminates arsenic or thallium as grain refiners.

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Hytech C

Hytech C is mildly acidic cobalt hardened gold process and is used for rack and barrel plating for industrial applications.

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Hytech Gold Strike

Hytech Gold Strike is pure gold strike process for flash deposits. It is used prior to subsequent gold plating processes.

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Hytech N

Hytech N is mildly acidic nickel hardened gold process and is used for rack and barrel plating for industrial applications.

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Hytech P

Hytech P is neutral gold process formulated specifically for printed circuit boards.

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PYRA-STRIP AU

PYRA-STRIP AU is specially designed for back stripping gold flash or bleed after selective plating process of connector parts in reel to reel equipment. It is also an excellent stripper for Gold reclaim or re-works purposes in barrel and rack operations.

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