Bondline 2121 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2121 Properties

Bondline 2121

Description

 

Bondline 2121 is a degassed, low viscosity, silver filled, premixed and frozen epoxy. It is formulated for general purpose applications.It provides good adhesion and low volume resistivity with a room temperature or slightly elevated heat cure.

Chemical Properties

Appearance Silver Paste
Chemical Composition Silver; Diethylenetriamine; N-Butyl Glycidyl; Bisphenol A/Epichlorohydrin Epoxy; Polyamide Resin
Solubility Insoluble
Viscosity 9000 cPs