Bondline 2258 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2258 Properties

Bondline 2258



Bondline 2258 is an electrically and thermally conductive semiconductor grade adhesive. This stress absorbing, silver filled epoxy is designed for bonding chips to substrates with a mismatch in coefficient of thermal expansion.

Chemical Properties uses cookies to ensure that we give you the best experience on our website. By using this site, you agree to our Privacy Policy and our Terms of Use. X