Bondline 2900 LV Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2900 LV Properties

Bondline 2900 LV

Description

 

Bondline 2900 LV is a silver filled semiconductor grade die attach epoxy. It is non-tailing, non-bleeding, non-corrosive. Bondline 2900 LV is ideal for auto dispensing, stamping, screening, and excellent adhesion to copper, silver, and gold surfaces.

Chemical Properties

Appearance Silver Paste
Chemical Composition Silver;Bisphenol A;Epichlorohydrin Epoxy
Solubility Insoluble