Bondline 2900 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2900 Properties

Bondline 2900

Description

 

Bondline 2900 is a silver filled semiconductor grade die attach epoxy.It is non-tailing, non-bleeding,non-corrosive. Bondline 2900 is ideal for auto dispensing, stamping,screening, and excellent adhesion to copper, silver, and gold surfaces.

Chemical Properties

Chemical Composition Silver;Bisphenol A;Epichlorohydrin Epoxy
Solubility Insoluble
Viscosity 22,000 cPs