Bondline 2920 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2920 Properties

Bondline 2920

Description

 

Bondline 2920 is a silver filled, electrically conductive epoxy adhesive. It has low levels of water extractible ionic contaminates. It is designed for microelectronic chip bonding.

Chemical Properties

Appearance Silver Paste
Chemical Composition Silver; Bisphenol A;Epichlorohydrin Epoxy
Solubility Insoluble
Viscosity 22,000 cPs
www.worldofchemicals.com uses cookies to ensure that we give you the best experience on our website. By using this site, you agree to our Privacy Policy and our Terms of Use. X