Bondline 2990 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 2990 Properties

Bondline 2990

Description

 

Bondline 2990 is a silver filled, die attach adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.It has excellent adhesion to copper, silver and gold.

Chemical Properties

Appearance Silver Paste
Chemical Composition Silver; Bisphenol A;Epichlorohydrin Epoxy
Solubility Insoluble
Viscosity 19000 cPs