Bondline 6158 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 6158 Properties

Bondline 6158

Description

 

Bondline 6158 is a dielectric, flexible adhesive. It has low extractable ions which makes it suitable for the semiconductor industry.

Chemical Properties

Appearance Black Paste
Chemical Composition Bisphenol A Resin
Solubility Insoluble