Bondline 6175 Properties, Molecular Formula, Applications - WorldOfChemicals

Bondline 6175 Properties

Bondline 6175

Description

 

Bondline 6175 is a premixed and frozen structural epoxy adhesive. It is formulated for high peel strength and micro-dimensional stability in magnetic head applications. It?s moisture resistant characteristics prevent swelling when subjected to high humidity and thermal cycling.

Chemical Properties

Appearance Off white Color, Paste
Chemical Composition Epoxy Resin; Silica; Polyoxyproplene Diamine
Solubility Partially Soluble
Viscosity 9000 cPs