3M opens temporary wafer bonding application lab in Taiwan

3M opens temporary wafer bonding application lab in Taiwan

10:40 AM, 16th July 2011
3M opens temporary wafer bonding application lab in Taiwan
3M's Semiconductor Innovation Centre is home to the company's new application laboratory for 200mm and 300mm temporary wafer bonding, located in Yangmei, Taiwan. (Photo: 3M)

ST PAUL, US: 3M has opened an application laboratory in Yangmei, Taiwan, for 200 mm and 300 mm temporary wafer bonding. The 3M Semiconductor Innovation Centre offers customers in Taiwan and throughout Asia access to 3M’s Wafer Support System  materials and processes for temporary bonding for ultra-thin wafer handling applications for 3D integrated circuit packaging. The addition expands 3M’s existing wafer support applications laboratories in Japan and the United States to meet customer demand.

The addition of the WSS capabilities enables customer evaluation and testing of 3M’s WSS materials including 3M’s Liquid UV-Curable Adhesives and Light-To-Heat Conversion (LTHC) coating.

“3M is committed to bringing innovation to our customers that help them fulfill the demanding 3D-IC packaging requirements for advanced semiconductors. Now 3M innovation is even more accessible,” said Jeffrey Chen, Division Manager, Electronics Markets Materials Division in Taiwan, 3M.

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