BASF presents new materials industrial 3D-printing applications
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BASF presents new materials for industrial 3D-printing applications

10:18 AM, 9th April 2018
BASF presents new materials for industrial 3D-printing applications
Photo-Resin X004M is suitable for break-resistant parts, for example post-coloured electric circuit connectors.

LUDWIGSHAFEN, GERMANY: BASF SE said that it is presenting a variety of new materials for 3D printing technologies. Together with Essentium Materials, BASF 3D Printing Solutions is also building up a global distribution network for plastic filaments. Both companies are systematically pooling a substantial part of their industrial filament materials under the name Ultrafuse.

All the filaments in the Ultrafuse series have been developed for industrial applications.

The offer also includes comprehensive expertise in application development and knowhow in fused filament fabrication (FFF). The cross-regional distribution agreement covers several products. They include Ultrafuse Z, a special, extra strong filament based on BASF materials, further developed by Essentium, and offered in combination with Essentium Materials’ processing technology, FlashFuse.

In the course of the year, the cooperation partners intend to launch further, filled and flame-retardant filaments.

“We want to offer our customers all over the world high-quality, high-performance materials for fused filament fabrication printing technology. This enables us to provide a special material for FFF that allows printing components with optimum strength in the z-direction,” said Firat Hizal, marketing & sales manager plastic filaments at BASF 3D Printing Solutions.

Low-melting polyamide 6 for standard machines

Ultrasint PA6 LM X085 is a new material for use in selective laser sintering (SLS) processes. This grey polyamide-6-based powder melts at about 193 degrees Celsius and is easy to process on most commonly used SLS machines.

BASF 3D Printing Solutions is also working on various new developments in the field of UV-reactive materials. Photo-Resin X004M, which recently became available, has been specially optimized for stereolithography (SLA), digital light processing (DLP) and LCD printers, in which the light source is placed beneath the printing material. With its high tensile strength and high elasticity modulus, the new material gives convincing results.

“We also plan to bring our latest material developments in the area of photopolymers to the market in the near future, to meet industry customers’ requirements for flexible and above all high strength photopolymer components,” said Andras Marton, marketing & sales manager photopolymers at BASF 3D Printing Solutions.

Further developments in UV-reactive materials derive from the area of ceramic photopolymers, which allow additive manufacturing of metal-casting moulds for applications in the aerospace and automotive sectors, for example.

BASF will present the products at the Additive Manufacturing Users Group (AMUG) Conference.

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