HB Fuller acquires Engent, increases microelectronic technology capacity

HB Fuller acquires Engent, increases microelectronic technology capacity

9:05 AM, 11th September 2012
HB Fuller acquires Engent, increases microelectronic technology capacity

ST PAUL, US: HB Fuller Company has finalized the purchase of Engent Inc, a provider of manufacturing, research and development services to the electronics industry. The Engent business adds state-of-the-art development capabilities, testing resources and technical support infrastructure. As a global, adhesives solutions provider in the highly attractive, fast growing and demanding electronics market, HB Fuller has now increased its market knowledge and qualification capabilities in a wide range of microelectronic assembly technologies.

“With this acquisition, we add advanced application technology, people and process knowledge that will enhance our growing business in electronics. Within this market, there is a diverse range of technologies being produced today and under development for production tomorrow. We plan to participate fully in these opportunities in this dynamic segment by combining and leveraging the adhesive development capabilities, investment resources and global reach of HB Fuller with the electronics expertise of Engent,” said Jim Owens, President and CEO, HB Fuller.

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