Low modulus, heat dissipating adhesive sheets power devices

Low modulus, heat dissipating adhesive sheets for power devices

6:41 AM, 9th July 2018
Low modulus, heat dissipating adhesive sheets for power devices
The LIOELM FTS is a thermal material that maintains an ultra-low elastic modulus.

Toyochem Co. Ltd. a member of the Toyo Ink Group of Japan launched the LIOELM™ FTS series of thermally conductive adhesive sheets as a heat-dissipation solution in power devices. Efficient thermal management is critical for reliability and performance of high power electronics, especially those found in automotive applications. With the protection of sensitive electronics from overheating in mind, Toyochem researchers in Japan were able to solve the performance trade-off problem between the elastic modulus and thermal resistance that typically arises in conventional epoxy-based thermal interface materials. Ultra-low modulus for reduced resistance

The LIOELM FTS is a thermal material that maintains an ultra-low elastic modulus. Thanks to its soft consistency and special rheology, the LIOELM FTS fills in every void and conforms to every rough surface, thus creating a high strength interface between the heatsink and the package. This results in optimum heat transfer and reduced thermal stress at the interface, making it possible to reach the low levels of thermal resistance necessary to transfer heat effectively.

High heat durability without compromising conductivity Along with an ultra-low modulus, the LIOELM FTS demonstrates excellent thermal durability and insulation reliability at high temperatures (up to 180°C), while still maintaining good thermal conductivity (up to 10W/m-K). Toyochem researchers accomplished this by combining its unique polymer with highly conductive fillers to create a thermal interface with excellent bond strength and high conductivity, and durable dielectric strength. Thanks to its unique sheet design, the LIOCHEM FTS quickly transfers heat from the source to the heat sink, while reliably insulating the electronic device from high voltages and thermal shock. This enables the interface material to effectively dissipate sizable levels of heat for the most demanding power electronics, in particular for next generation electric vehicles.

Thermally conductive interface materials are essential to automotive semiconductors and power devices. They not only dissipate heat between devices and heatsink systems but also offer thermal resistance and reliable insulation properties to help protect components and systems from extreme environments for long durations.

Epoxy resins are primarily used in interface materials due to their high heat resistance. Cured epoxy resins generally posses a high elastic modulus, thus making it difficult to absorb the thermal strains that are generated by the differences in linear expansion coefficients between two joined materials. This can lead to cracking, peeling or other problems at the interface like excessive thermal strain or reduced insulation properties. Incidentally, a soft material had not been put to practical use due to its low heat resistance and thermal conductivity.

In developing the LIOELM FTS adhesive sheet, the Toyo Ink group researchers applied an original resin and film technology for controlling elasticity in order to create an interface material that demonstrates both a soft elasticity and thermal conductivity. The LIOELM FTS’s unique composition relaxes the thermal stress between joined layers, even in bonds where thermal strains arise, making it possible to achieve a high level of adhesion, thermal conductivity and insulation reliability for long periods of time.

Toyochem is spotlighting the LIOELM FTS thermally conductive adhesive sheets and its other thermal management solutions in Europe.

Source: Toyochem Co. Ltd.

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