SEMATECH, Cabot Microelectronics JV for CMP technology

ALBANY, US: Cabot Microelectronics Corporation has joined with SEMATECH’s front end processes (FEP) programme and will develop advanced solutions for emerging chemical mechanical planarization (CMP) applications. The goal of SEMATECH’s FEP programme is to enable novel leading-edge materials, processes, structural modules and electrical and physical characterization methods to support the continued scaling of logic and memory applications.

As semiconductor device sizes shrink, new materials are introduced, and higher yields are targeted. Achieving wafer scale planarity through CMP has become increasingly challenging. These issues are expected to continue to become more challenging in the context of low-power technologies.

“SEMATECH provides Cabot Microelectronics with excellent process capability to help identify and demonstrate emerging applications for CMP consumables. We expect this collaboration to help enable Cabot Microelectronics support our customers’ emerging CMP requirements,” said Ananth Naman, Vice President, R&D, Cabot Microelectronics.

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