Showa Denko’s stronger aluminium plate mobile devices

Showa Denko’s stronger aluminium plate for mobile devices

11:47 AM, 26th April 2016
Showa Denko’s stronger aluminium plate for mobile devices
“ST60-HSM” aluminium plate, a new grade product of ST60-series aluminium plates which boast high thermal conductivity and high strength, suitable for mobile device enclosure.

TOKYO, JAPAN: Showa Denko KK (SDK) has developed “ST60-HSM” aluminium plate, a new grade product of ST60-series aluminium plates which boast high thermal conductivity and high strength. ST60-HSM (High Strength Metal) has attained high strength equivalent to A6061 aluminium alloy (contains copper and other metals as additives to enhance strength, and shows further strength after solution, hardening and aging treatments), while maintaining the same bendability and thermal conductivity as existing grades of ST60 series have.

ST60 series is equal to pure aluminium in thermal conductivity and heat radiation capacity, and A5052aluminium alloy (has medium strength among aluminium alloys, and known as standard material. It has excellent anti corrosiveness, seawater resistance, and weldability, and is used as material for ships, automobile parts, interior and exterior finishing materials), which is widely used as material for frames, in strength. Since their launches, ST60-T3, that features high-bendability, has been used as heat sink, and ST60-T8, that features high-strength, has been used mainly as metallic base panels and parts for smartphones.

In recent years, manufacturers of mobile devices including smartphones and tablets tend to apply metal enclosures to high-end and middle-range products in order to give them enhanced rigidity and better designs. Moreover, these manufacturers expressly prefer to apply aluminium enclosures in order to take advantage of attractiveness of anodized surfaces. Though previously launched grades of ST60 series have already been applied to enclosures for mobile devices, SDK developed ST60-HSM this time in order to meet increasing need for stronger aluminium enclosures.

By putting ST60-HSM on the market, SDK aims to expand adoption of ST60 series as enclosures for mobile devices.

© Worldofchemicals News


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