Superthin nanoglue next-generation microchip fabrication

Superthin nanoglue for next-generation microchip fabrication

2:17 AM, 12th March 2012
Superthin nanoglue for next-generation microchip fabrication
Tingrui Pan, Professor, Biomedical Engineering, University of California.

CALIFORNIA, US: Engineers at the University of California, Davis, have invented a superthin “nanoglue” that could be used in new-generation microchip fabrication. “The material itself would break before the glue peels off,” said Tingrui Pan, Professor, Biomedical Engineering, University of California. Conventional glues form a thick layer between two surfaces. Pan’s nanoglue, which conducts heat and can be printed, or applied, in patterns, forms a layer thickness of only a few molecules.

The nanoglue is based on a transparent, flexible material called polydimethylsiloxane, or PDMS, which, when peeled off a smooth surface usually leaves behind an ultrathin, sticky residue that researchers had mostly regarded as a nuisance. Pan and his colleagues realized that this residue could instead be used as glue, and enhanced its bonding properties by treating the residue surface with oxygen.

The nanoglue could be used to stick silicon wafers into a stack to make new types of multilayered computer chips. According to Pan it could also be used for home applications, for example, as double-sided tape or for sticking objects to tiles. The glue only works on smooth surfaces and can be removed with heat treatment.

© University of California News



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