Wacker launch 2 silicone elastomers encapsulating LEDs

Wacker to launch 2 silicone elastomers for encapsulating LEDs

12:00 PM, 4th October 2016
Wacker to launch 2 silicone elastomers for encapsulating LEDs
The silicone grades effectively protect the sensitive LED semiconductor chip against environmental influences. They can additionally serve as carriers for luminescent dyes, which can selectively influence the color of the light emitted by the LED.

MUNICH, GERMANY: Wacker Chemie AG to launch two new encapsulation compounds for light-emitting diodes (LED). The encapsulants LUMISIL740 and LUMISIL770 cure to form highly visible silicone elastomers. Both silicones withstand exceptionally high operating temperatures and strong light radiation without yellowing or becoming brittle. They are hence perfect for encapsulating high-performance LEDs.

These encapsulants efficiently protect the sensitive LED semiconductor chip against ecological effects. They can also serve as carriers for luminescent dyes, which can selectively influence the color of the light emitted by the LED.

A special feature of these encapsulants is their tremendously high heat, light and thermal-shock resistance. Corresponding aging tests confirm this. After 500 hours of storage at 245 degrees Celsius, LUMISIL 740 test specimens display neither yellowing nor embrittlement. Even after 1,000 hours, the change in the cured rubber grades is insignificant. This has proven particularly resistant to combined heat and light exposure.

In a thermal shock test going from +125 to -45 degrees Celsius, both materials withstand more than 1,000 test cycles. The encapsulation compounds are thus able to compensate thermomechanical stresses that can arise as a result of the different thermal expansions of the LED materials.

Due to their stability, the new silicones are particularly suitable for encapsulating LED chips with strong heat generation and intense light emission. The two grades differ mainly in the hardness of the cured products. LUMISIL740 cures to form a material with a Shore A hardness of 50, while LUMISIL 770 is formulated to be slightly harder at Shore A 70.

Its property outline makes LUMISIL 740 ideal for the encapsulation of multi-chip LEDs that are applied using the chip-on-board technology – mounted directly onto the printed circuit board, tightly packed, without casing. LUMISIL 770, on the other hand, is the material of choice for encapsulating single-chip LEDs.

The viscosity of the two encapsulation materials has been adjusted so that they can easily be applied by dispensing. LUMISIL740 and LUMISIL770 are self-adhesive. They adhere to the semiconductor chip and to straight reflector and casing substrates without pretreatment.

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